Standard
Pre heater table Bond heater table Auto nozzle cleaning Ultrasonic checking
Bump collapse height measurement Bump absence detection
Bad mark detection Wafer theta axis correction
Wafer expansion Hot blow
Nozzle surface monitoring LAN
Nozzle bonding counter Production management data
Option and Special Features
Magazine Loader/Unloader Hepa-filter
Ionizer
Profile monitor（US,Load,Bump height）
Chip tray supply
Map data（between bump bonder etc）
Bond nozzle heater
Substrate（package）special clamp
Bond inspection（Pre , Post）
Bond nozzle polishing jig
Ultrasonic horn（For large chip）
