Flip-chip Bonding Machine-AFM1506-TDK-产品中心-阿尔泰克ALLTECH

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Flip-chip Bonding Machine-AFM1506

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Standard
Pre heater table Bond heater table Auto nozzle cleaning Ultrasonic checking
Bump collapse height measurement Bump absence detection
Bad mark detection Wafer theta axis correction
Wafer expansion Hot blow
Nozzle surface monitoring LAN
Nozzle bonding counter Production management data

名称：Flip-chip Bonding Machine-AFM1506

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